Effect of pad roughness on shear strength of thin small leadless package

• Main Author: Ong, Cheng Guan
• Format: Thesis
• Language: English; English
• Published: UTeM 2018
• Subjects: T Technology (General); TK Electrical engineering. Electronics Nuclear engineering
• Online Access: http://eprints.utem.edu.my/id/eprint/23454/1/Effect%20Of%20Pad%20Roughness%20On%20Shear%20Strength%20Of%20Thin%20Small%20Leadless%20Package%20-%20Ong%20Cheng%20Guan%20-%2024%20Pages.pdf; http://eprints.utem.edu.my/id/eprint/23454/2/Effect%20of%20pad%20roughness%20on%20shear%20strength%20of%20thin%20small%20leadless%20package.pdf; http://eprints.utem.edu.my/id/eprint/23454/; https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=112834&query_desc=kw%2Cwrdl%3A%20Effect%20of%20pad%20roughness%20on%20shear%20strength%20of%20thin%20small%20leadless%20package

Thin Small Leadless Packages (TSLP) have been manufactured to cater the current industry demand for a smaller electronic apparatus with a higher electrical performance. Previous studies showed the solder joint strength of leadless package with the printed circuit board (PCB) using Ni-P/Sn-0.5 Ag sol...