Soldering Characteristics And Thermomechanical Properties Of Pb-Free Solder Paste For Reflow Soldering

• Main Authors: Ali Mokhtar, Mohd Najib, Mohammed Zulkifly, Abdullah, Saad, Abdullah Aziz, Che Ani, Fakhrozi, Samsudin, Zambri
• Format: Article
• Language: English
• Published: Penerbit Universiti Teknikal Malaysia Melaka 2019
• Online Access: http://eprints.utem.edu.my/id/eprint/24458/2/5507-14908-1-SM_JAMT2019.PDF; http://eprints.utem.edu.my/id/eprint/24458/; https://jamt.utem.edu.my/jamt/article/view/5507/3782

A deep understanding in thermal characteristics of lead-free solder paste grades is one of the most crucial factors when dealing with reflow soldering process. These temperatures are critical parameters for proper settings of the real reflow process. This report is devoted to discussing the findings...