Improvement of molding process scheduled downtime reduction for integrated circuits package DPAK STS

• Main Author: Heng, Soo Ann
• Format: Thesis
• Language: English; English
• Published: 2016
• Subjects: T Technology (General); TP Chemical technology
• Online Access: http://eprints.utem.edu.my/id/eprint/20941/1/Improvement%20of%20molding%20process%20Scheduled%20Downtime%20reduction%20for%20integrated%20circuits%20package%20DPAK%20STS.pdf; http://eprints.utem.edu.my/id/eprint/20941/2/Improvement%20of%20molding%20process%20Scheduled%20Downtime%20reduction%20for%20integrated%20circuits%20package%20DPAK%20STS.pdf; http://eprints.utem.edu.my/id/eprint/20941/; https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104922

This master project proposed is to look insight into semiconductor field related project which has the topic of IMPROVEMENT OF MOLDING PROCESS SCHEDULED DOWNTIME FOR INTEGRATED CIRCUITS PACKAGE DPAK STS where common name of Dpak will be power product T0252 series. First and foremost, the topic invol...