Microcrack Detection And Noise Reduction In Integrated Circuit Packages

• Main Author: Koh, Ye Sheng
• Format: Monograph
• Language: English
• Published: Universiti Sains Malaysia 2018
• Subjects: T Technology; TK Electrical Engineering. Electronics. Nuclear Engineering
• Online Access: http://eprints.usm.my/53577/1/Microcrack%20Detection%20And%20Noise%20Reduction%20In%20Integrated%20Circuit%20Packages_Koh%20Ye%20Sheng_E3_2018.pdf; http://eprints.usm.my/53577/

The rise in consumption of electronic products in the recent years have subsequently led to an increase in manufacturing of integrated circuits (ICs) to meet consumers’ demands. Thus, it is vital that each IC is inspected for defects that compromises its quality and usability. This ensures that no d...