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Arc Vapour Deposition Of Iron Film During Magnetron Sputtering Of Ti Film: Effect Of Substrate’s Materials And Surface Roughness

Arcing of non-target surface is the main contamination cause of sputtering process, which could be minimized through the effective control of the deposition parameters. However, there is an insufficient understanding of the arc vapour deposition’s role to the film contamination during magnetron sput...

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Bibliographic Details
Main Authors: Lau, Kok Tee, Zurianee, Lokman Loganathan, Roslan, Abd. Shukor
Format: Article
Language:English
Published: Electrochemical Science Group 2015
Subjects:
T Technology (General)
TS Manufactures
Online Access:http://eprints.utem.edu.my/id/eprint/15973/2/ARC%20VAPOUR%20DEPOSITION%20OF%20IRON%20FILM%20DURING%20MAGNETRON%20SPUTTERING%20OF%20TI%20FILM.pdf
http://eprints.utem.edu.my/id/eprint/15973/
http://www.scopus.com/record/display.uri?eid=2-s2.0-84936797527&origin=inward&txGid=0
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http://eprints.utem.edu.my/id/eprint/15973/2/ARC%20VAPOUR%20DEPOSITION%20OF%20IRON%20FILM%20DURING%20MAGNETRON%20SPUTTERING%20OF%20TI%20FILM.pdf
http://eprints.utem.edu.my/id/eprint/15973/
http://www.scopus.com/record/display.uri?eid=2-s2.0-84936797527&origin=inward&txGid=0

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