XRD Analysis Of Cu-Al Interconnect Intermetallic Compound In An Annealed Micro-Chip

• Main Authors: Chua, Kok Yau, Hng, May Ting, Lee, Cher Chia, Thangaraj, Joseph Sahaya Anand
• Format: Article
• Language: English
• Published: Trans Tech Publications 2013
• Online Access: http://eprints.utem.edu.my/id/eprint/10252/1/24_AMR_620.pdf; http://eprints.utem.edu.my/id/eprint/10252/; http://www.scientific.net

Cu-Al intermetallic compound (IMC) in Cu wire-Al bond pad interconnect interface is drawing attention of researches. However, due to thin IMC thickness, the characterizations of the IMC are limited to expensive and time consuming techniques. An evaluation is performed to use common X-Ray Diffraction...