XRD Analysis Of Cu-Al Interconnect Intermetallic Compound In An Annealed Micro-Chip

Cu-Al intermetallic compound (IMC) in Cu wire-Al bond pad interconnect interface is drawing attention of researches. However, due to thin IMC thickness, the characterizations of the IMC are limited to expensive and time consuming techniques. An evaluation is performed to use common X-Ray Diffraction...

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Bibliographic Details
Main Authors: Chua, Kok Yau, Hng, May Ting, Lee, Cher Chia, Thangaraj, Joseph Sahaya Anand
Format: Article
Language:English
Published: Trans Tech Publications 2013
Online Access:http://eprints.utem.edu.my/id/eprint/10252/1/24_AMR_620.pdf
http://eprints.utem.edu.my/id/eprint/10252/
http://www.scientific.net
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