Structural Integrity Study Of Ultra-Fine Solder Joint Using Microscopy Investigation

• Main Author: Zahit, Mohd Amier Hasief Mat
• Format: Monograph
• Language: English
• Published: Universiti Sains Malaysia 2017
• Subjects: T Technology; TJ1 Mechanical engineering and machinery
• Online Access: http://eprints.usm.my/54408/1/Structural%20Integrity%20Study%20Of%20Ultra-Fine%20Solder%20Joint%20Using%20Microscopy%20Investigation_Mohd%20Amier%20Hasief%20%20Mat%20Zahit_M4_2017.pdf; http://eprints.usm.my/54408/

The electronic industries are changing the solder used from the lead solder to the lead-free solder. The elimination of lead solder is done due to the new laws and restrictions. The lead-free solder is extensively used in the electronic assemblies and there is also concerns about the lead-free solde...