Influence Of Squeegee Impact On Stencil Printing Process- CFD Approach
High requirement of smaller size, lighter weight, and high performance PCB in electronic packaging has contributed to the wide application of stencil printing for soldering process. Stencil printing offers good consistency of soldering performance as well as produce larger process output at short ti...
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| Format: | Monograph |
| Language: | English |
| Published: |
Universiti Sains Malaysia
2017
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| Online Access: | http://eprints.usm.my/53723/1/Influence%20Of%20Squeegee%20Impact%20On%20Stencil%20Printing%20Process-%20CFD%20Approach_Mohd%20Hazim%20Sadiq%20Abd%20Samad_M4_2017.pdf http://eprints.usm.my/53723/ |
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