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Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging

Thermal analysis in single die and stacked dies electronic packaging for portable communication devices is very important due to lack of real estate for active cooling. Recent research had focused on active cooling and neglected the low cost passive cooling by optimizing the architecture of package...

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Main Author: Law, Ruen Ching
Format: Thesis
Language:English
Published: 2012
Subjects:
TJ1-1570 Mechanical engineering and machinery
Online Access:http://eprints.usm.my/41921/1/LAW_RUEN_CHING.pdf
http://eprints.usm.my/41921/
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spelling my.usm.eprints.41921 http://eprints.usm.my/41921/ Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging Law, Ruen Ching TJ1-1570 Mechanical engineering and machinery Thermal analysis in single die and stacked dies electronic packaging for portable communication devices is very important due to lack of real estate for active cooling. Recent research had focused on active cooling and neglected the low cost passive cooling by optimizing the architecture of package structure and material selection. Stacked dies electronic package is an economical and good electrical performance innovation but inherent thermal problems which caused by thermal crosstalk. Recent methodology for numerical method and measurement method for thermal analysis in QFN and stacked dies LBGA is labor intensive, needs huge amount of investment and requires expert’s knowledge. 2012-03 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/41921/1/LAW_RUEN_CHING.pdf Law, Ruen Ching (2012) Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging. Masters thesis, Universiti Sains Malaysia.
institution Universiti Sains Malaysia
building Hamzah Sendut Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Sains Malaysia
content_source USM Institutional Repository
url_provider http://eprints.usm.my/
language English
topic TJ1-1570 Mechanical engineering and machinery
spellingShingle TJ1-1570 Mechanical engineering and machinery
Law, Ruen Ching
Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging
description Thermal analysis in single die and stacked dies electronic packaging for portable communication devices is very important due to lack of real estate for active cooling. Recent research had focused on active cooling and neglected the low cost passive cooling by optimizing the architecture of package structure and material selection. Stacked dies electronic package is an economical and good electrical performance innovation but inherent thermal problems which caused by thermal crosstalk. Recent methodology for numerical method and measurement method for thermal analysis in QFN and stacked dies LBGA is labor intensive, needs huge amount of investment and requires expert’s knowledge.
format Thesis
author Law, Ruen Ching
author_facet Law, Ruen Ching
author_sort Law, Ruen Ching
title Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging
title_short Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging
title_full Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging
title_fullStr Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging
title_full_unstemmed Methodologies For Thermal Analysis In Single Die And Stacked Dies Electronic Packaging
title_sort methodologies for thermal analysis in single die and stacked dies electronic packaging
publishDate 2012
url http://eprints.usm.my/41921/1/LAW_RUEN_CHING.pdf
http://eprints.usm.my/41921/
_version_ 1643710360430051328
score 13.2014675

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