Particle Removal In Post Chemical-Mechanical Planarization (Cmp) Cleaning Process: Experimental And Modeling Studies
Proses pencucian pasca perataan secara mekanikal-kimia memainkan peranan penting dalam teknologi wafer kerana ia adalah salah satu objektif untuk menghasilkan permukaan yang berkualiti tinggi bagi dimensi yang halus. Kajian ini terdiri daripada eksperimen dan teori untuk menilai kecekapan penying...
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Main Author: | Lok , Yian Han |
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Format: | Thesis |
Language: | English |
Published: |
2009
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Subjects: | |
Online Access: | http://eprints.usm.my/41279/1/Lok_Yian_Han24.pdf http://eprints.usm.my/41279/ |
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