Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process

• Main Author: Chellvarajoo, Srivalli
• Format: Thesis
• Language: English
• Published: 2016
• Subjects: T Technology; TJ1-1570 Mechanical engineering and machinery
• Online Access: http://eprints.usm.my/40991/1/Nano_Particle_Reinforced_Lead-Free_Sn%E2%80%933.0Ag%E2%80%930.5Cu_Solder_Paste_for_Reflow_Soldering_Process.pdf; http://eprints.usm.my/40991/

Kini penyelidik mula menguatkan pateri tanpa plumbum dengan zarah nano bagi menghasilkan pateri komposit nano berkualiti tinggi. Kajian ke atas campuran pateri yang diperkuat nano dikehendaki oleh jurutera dan penyelidik bagi menyelesaikan masalah pateri terkini dan boleh meningkatkan kualiti sambungan pateri dan merupakan focus bagi penyelidikan ini. Justeru, penyelidikan ini menjalankan kajian kes ke atas perbezaan jenis zarah nano seramik (i.e., oksida pelbagai: Fe2NiO4, ITO; oksida unsur tunggal: NiO, Fe2O3) dan zarah karbon struktur nano (CN) (i.e. berlian) sebagai pemboleh-ubah yang dimanipulasikan, digunakan bagi menguatkan aloi pateri SAC 305 secara mekanik. Kesan parameter ini keatas kelakuan lebur, analisis struktur mikro (i.e., ketebalan IMC, pergerakan zarah nano semasa proses pateri aliran semula), kadar serakkan, sudut basah dan kekerasan pateri selepas proses pematerian aliran semula dianalisis. Korelasi diantara pateri yang diperkuat zarah nano dengan beberapa faktor telah dikaji. Ia telah dikenal-pasti bagi campuran pateri diperkuat CN (i.e., berlian) menunjukkan perbezaan ketara dalam kelakuan dan mencapai kekerasan tertinggi, dengan penambahan yang sedikit (i.e., 0.5wt.%) diperkuatkan berbanding dengan jenis zarah nano yang lain. Dengan keputusan ini, zarah nano berlian telah digunakan bagi kajian parameter lanjutan ke atas faktor kualiti (i.e., daya ricih dan tarikan). Kesan daya ricih dan tarikan bagi jumlah perbezaan zarah nano berlian yang digunakan (0.01wt.%, 0.05wt.% dan 0.1wt.%) dengan susuk aliran semula telah dikaji. Pengukuhan 0.01wt% zarah nano berlian bagi pateri SAC 305 meningkatkan daya ricih PCBA dan tarikan masing-masing sebanyak 7.4% dan 26.4%. Oleh itu, kajian ini menunjukkan keberhasilan baru keatas CN berdasarkan zarah nano yang diperkuatkan dalam pateri tuang tanpa plumbum bagi meningkatkan kualiti pakej. Zarah nano berdasarkan CN memerlukan hanya sedikit bagi dicampur secara serata dalam pateri tuang SAC 305 dan memberikan peningkatan ketara bagi kualiti sambungan pateri. Tambahan pula, secara tak langsung mengurangkan kos pengeluran dan memberikan arah berguna bagi jurutera dan penyelidik dalam industri mikroelektronik di masa yang akan datang. ________________________________________________________________________________________________________________________ At present, researchers begin to reinforce nanoparticles into Pb free solders to develop high efficiency nanocomposite solders. The effects on nanoparticle reinforcement into SAC 305 after reflow to enhance the solder joint quality are focus of this research. Consequently, this investigation developed into parametric case studies on different type of ceramic nanoparticles (i.e., multielement oxide: Fe2NiO4, ITO; single element oxide: NiO, Fe2O3) and carbon-nanostructure (CN) particles (i.e., Diamond) as a manipulated variable (i.e., parameters) which are used to mechanically reinforce into SAC 305 solder alloys, respectively. The effects of these parameters on melting behavior, microstructures analysis (i.e., IMC thickness, nanoparticles motion during reflow), spreading rate, wetting angle and solder hardness after reflow have been analyzed. The correlations between the reinforced nanoparticles with the respective factors have been studied. From this research, it was identified that CN (i.e., Diamond) reinforced solder paste showed unique differences in the behavior and reached highest hardness with very little amount (i.e., 0.5wt.%) of reinforcement among the type of nanoparticles tested. As a result, diamond nanoparticles were used to extend the parametric studies with the mechanical tests (i.e., shear test and pull test). The effects of both shear and pull strengths towards different amount of diamond nanoparticles (0.01wt.%, 0.05wt.% and 0.1wt.%) with respective reflow profile were studied. The addition of 0.01wt.% diamond nanoparticles in SAC 305 solder enhanced the PCBA shear and pull force by 7.4 % and 26.4 %, respectively. Hence, the current study generates a new expectation on CN based nanoparticles to be reinforced in Pb free solder alloys to enhance package quality. The CN based nanoparticles required in little amount to homogeneously mixed in SAC 305 solder alloys and contribute improvement in solder joint quality. Moreover, it indirectly reduced the production cost and allocates valuable directions for the engineers and researchers in upcoming microelectronics industry.