Physical and mechanical properties enhancement of lead free solders reinforced with carbon nanotubes: a critical review

Owing to the great advancement in technology, the input/output terminals in electronic packaging have greatly increased resulting to a proportional increase in solder interconnection joints of electrical components. Therefore, in order to work in line with the mission and vision of the electronic in...

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Bibliographic Details
Main Authors: Dele-Afolabi, T. T., Mohamed Ariff, Azmah Hanim, Mazlan, Norkhairunnisa, Mohamed Yusoff, Hamdan
Format: Article
Published: American-Eurasian Network for Scientific Information 2014
Online Access:http://psasir.upm.edu.my/id/eprint/34915/
http://www.aensiweb.com/old/aeb_Special3_2014.html
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