Intermetallic growth of SAC237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes

• Main Authors: Mohd Najib, Mohamad Aznan, Mohamed Ariff, Azmah Hanim, Roslan, Muhammad Raimi, Anuar, Muhammad Azrol Amin
• Format: Conference or Workshop Item
• Language: English
• Published: 2015
• Online Access: http://psasir.upm.edu.my/id/eprint/66182/1/Intermetallic%20growth%20of%20SAC237%20solder%20paste%20reinforced%20with%200.01wt.%25%20multi-walled%20carbon%20nanotubes.pdf; http://psasir.upm.edu.my/id/eprint/66182/

The formation of intermetallic compound (IMC) layer at the interfaces of pad finishes have been studied. The growth of IMC layer after as reflow process and its properties were also discussed. In this study, solder alloy SAC237 (Sn: 99 wt.%, Ag: 0.3 wt.%, Cu: 0.7 wt.%) reinforced with 0.01 wt.% Mult...