Alumina substrate for high frequency applications
The rapidly growing wireless industry needs new high performance materials to build low loss, high density, thermally stable integrated packages. Ceramic is one of the materials that can be used for thick film technology in high frequency application due the excellent combination of electrical, the...
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| Main Authors: | , , , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
Universiti Putra Malaysia Press
2005
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| Online Access: | http://psasir.upm.edu.my/id/eprint/34001/1/34001.pdf http://psasir.upm.edu.my/id/eprint/34001/ |
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