Stress intensity factors for Thermoelectric Bonded Materials weakened by an inclined crack

• المؤلفون الرئيسيون: Mohd Nordin, Muhammad Haziq Iqmal, Hamzah, Khairum, Nik Long, Nik Mohd Asri, Khashi’ie, Najiyah Safwa, Waini, Iskandar, Zainal, Nurul Amira, Sayed Nordin, Sayed Kushairi
• التنسيق: مقال
• منشور في: Semarak Ilmu Publishing 2024
• الوصول للمادة أونلاين: http://psasir.upm.edu.my/id/eprint/106298/; https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/4373

Thermoelectric Bonded Materials (TEBM) weakened by an Inclined Crack Problems (ICP) subjected to remote stress was presented in this study. The problems are addressed by employing the Modified Complex Variable Function (MCVF) method, which incorporates the Continuity Conditions (CC) for the Resultan...