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Process optimization approach in fine pitch Cu wire bonding

With SiO2 dielectric under aluminum pads, a 60 m bond pad pitch with 52 um bond pad opening Cu wire bonding process was developed in PBGA Hip 7 PGE wafer technology. The critical factors (wire type, capillary, and bonding parameter) and critical responses (bonded ball diameter, bonded ball height, w...

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Main Authors: Wong, B.K., Yong, C.C., Eu, P.L., Yap, B.K.
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Published: 2018
Online Access:http://dspace.uniten.edu.my/jspui/handle/123456789/8804
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spelling my.uniten.dspace-88042018-02-21T04:29:36Z Process optimization approach in fine pitch Cu wire bonding Wong, B.K. Yong, C.C. Eu, P.L. Yap, B.K. With SiO2 dielectric under aluminum pads, a 60 m bond pad pitch with 52 um bond pad opening Cu wire bonding process was developed in PBGA Hip 7 PGE wafer technology. The critical factors (wire type, capillary, and bonding parameter) and critical responses (bonded ball diameter, bonded ball height, wire pull, ball shear and number of metal lift/peeling and ball lift after wire pull) are affecting bonding quality. Design of experiment and response of surface were used to optimize the bonding parameters. The wire pull and ball shear test at three thermal aging read points were studied. © 2011 IEEE. 2018-02-21T04:29:36Z 2018-02-21T04:29:36Z 2011 http://dspace.uniten.edu.my/jspui/handle/123456789/8804
institution Universiti Tenaga Nasional
building UNITEN Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
url_provider http://dspace.uniten.edu.my/
description With SiO2 dielectric under aluminum pads, a 60 m bond pad pitch with 52 um bond pad opening Cu wire bonding process was developed in PBGA Hip 7 PGE wafer technology. The critical factors (wire type, capillary, and bonding parameter) and critical responses (bonded ball diameter, bonded ball height, wire pull, ball shear and number of metal lift/peeling and ball lift after wire pull) are affecting bonding quality. Design of experiment and response of surface were used to optimize the bonding parameters. The wire pull and ball shear test at three thermal aging read points were studied. © 2011 IEEE.
format
author Wong, B.K.
Yong, C.C.
Eu, P.L.
Yap, B.K.
spellingShingle Wong, B.K.
Yong, C.C.
Eu, P.L.
Yap, B.K.
Process optimization approach in fine pitch Cu wire bonding
author_facet Wong, B.K.
Yong, C.C.
Eu, P.L.
Yap, B.K.
author_sort Wong, B.K.
title Process optimization approach in fine pitch Cu wire bonding
title_short Process optimization approach in fine pitch Cu wire bonding
title_full Process optimization approach in fine pitch Cu wire bonding
title_fullStr Process optimization approach in fine pitch Cu wire bonding
title_full_unstemmed Process optimization approach in fine pitch Cu wire bonding
title_sort process optimization approach in fine pitch cu wire bonding
publishDate 2018
url http://dspace.uniten.edu.my/jspui/handle/123456789/8804
_version_ 1644494539846582272
score 13.160551

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