Study on reliability test of die attach material
Silver plated copper is a new developed die attachment material to replace pure silver. As year past, price of silver getting higher and become a problem for those semiconductors packaging company. Therefore, silver plated copper was developed as new die attachment material to solve the costing prob...
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2018
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Online Access: | http://dspace.uniten.edu.my/jspui/handle/123456789/8796 |
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