Study on reliability test of die attach material
Silver plated copper is a new developed die attachment material to replace pure silver. As year past, price of silver getting higher and become a problem for those semiconductors packaging company. Therefore, silver plated copper was developed as new die attachment material to solve the costing prob...
Saved in:
| Main Authors: | , , |
|---|---|
| Format: | |
| Published: |
2018
|
| Online Access: | http://dspace.uniten.edu.my/jspui/handle/123456789/8796 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|