Characterisation of insulated Cu wire ball bonding

• Main Authors: Leong, H.Y., Yap, B.K., Khan, N., Ibrahim, M.R., Tan, L.C., Faiz, M.
• 出版: 2018
• 在線閱讀: http://dspace.uniten.edu.my/jspui/handle/123456789/8785

Insulated Cu wire technology offers potential solutions for fine and ultra-fine pitch wire bonding as the insulator coating on the bare wire prevents wires shorting problem. Most previous works focused on insulated wire stitch bonding. This paper presents a comparison study between insulated Cu and...