Characterisation of insulated Cu wire ball bonding
Insulated Cu wire technology offers potential solutions for fine and ultra-fine pitch wire bonding as the insulator coating on the bare wire prevents wires shorting problem. Most previous works focused on insulated wire stitch bonding. This paper presents a comparison study between insulated Cu and...
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| 主要な著者: | , , , , , |
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2018
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| オンライン･アクセス: | http://dspace.uniten.edu.my/jspui/handle/123456789/8785 |
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