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Insulated Cu wire free air ball characterization

Insulated Cu wire technology has immense potential for fine pitch wire bonding interconnection. Understanding the behavior of the insulated Cu free air ball (FAB) formation is crucial for wire bonding process. The FAB formation, size, shape and cleanliness under different conditions for 20 μm insula...

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Main Authors: Leong, H., Yap, B., Khan, N., Ibrahim, M.R., Tan, L.C.
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Published: 2018
Online Access:http://dspace.uniten.edu.my/jspui/handle/123456789/8782
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spelling my.uniten.dspace-87822018-02-21T04:29:23Z Insulated Cu wire free air ball characterization Leong, H. Yap, B. Khan, N. Ibrahim, M.R. Tan, L.C. Insulated Cu wire technology has immense potential for fine pitch wire bonding interconnection. Understanding the behavior of the insulated Cu free air ball (FAB) formation is crucial for wire bonding process. The FAB formation, size, shape and cleanliness under different conditions for 20 μm insulated Cu wire were investigated using SEM, FESEM and FTIR surface analysis. The results were compared with that of bare Cu wire. Consistently spherical residue free FAB of insulated Cu wire were formed using forming gas. The samples with insulated Cu wire consistently produced larger FAB than that of bare Cu wire, indicating that the energy required for free air ball formation is lower. Basic bonding performances in terms of ball bond strength, intermetallic (IMC) coverage growth and stitch bond strength of insulated Cu wire at time zero are also discussed in the paper. © 2014 Elsevier Ltd. All rights. 2018-02-21T04:29:23Z 2018-02-21T04:29:23Z 2014 http://dspace.uniten.edu.my/jspui/handle/123456789/8782
institution Universiti Tenaga Nasional
building UNITEN Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
url_provider http://dspace.uniten.edu.my/
description Insulated Cu wire technology has immense potential for fine pitch wire bonding interconnection. Understanding the behavior of the insulated Cu free air ball (FAB) formation is crucial for wire bonding process. The FAB formation, size, shape and cleanliness under different conditions for 20 μm insulated Cu wire were investigated using SEM, FESEM and FTIR surface analysis. The results were compared with that of bare Cu wire. Consistently spherical residue free FAB of insulated Cu wire were formed using forming gas. The samples with insulated Cu wire consistently produced larger FAB than that of bare Cu wire, indicating that the energy required for free air ball formation is lower. Basic bonding performances in terms of ball bond strength, intermetallic (IMC) coverage growth and stitch bond strength of insulated Cu wire at time zero are also discussed in the paper. © 2014 Elsevier Ltd. All rights.
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author Leong, H.
Yap, B.
Khan, N.
Ibrahim, M.R.
Tan, L.C.
spellingShingle Leong, H.
Yap, B.
Khan, N.
Ibrahim, M.R.
Tan, L.C.
Insulated Cu wire free air ball characterization
author_facet Leong, H.
Yap, B.
Khan, N.
Ibrahim, M.R.
Tan, L.C.
author_sort Leong, H.
title Insulated Cu wire free air ball characterization
title_short Insulated Cu wire free air ball characterization
title_full Insulated Cu wire free air ball characterization
title_fullStr Insulated Cu wire free air ball characterization
title_full_unstemmed Insulated Cu wire free air ball characterization
title_sort insulated cu wire free air ball characterization
publishDate 2018
url http://dspace.uniten.edu.my/jspui/handle/123456789/8782
_version_ 1644494533402034176
score 13.164666

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