Deflection analysis of epitaxially deposited polysilicon encapsulation for MEMS devices
Numerical and simulation studies are done to determine deflection behavior of epitaxially deposited polysilicon encapsulation. Polysilicon encapsulation, which is used as physical protection for moving parts of MEMS devices, is applied with external pressure to replicate packaging processes. Polysil...
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| 主要な著者: | , , |
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2017
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| オンライン･アクセス: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5323 |
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