Warpage and wire sweep analysis of QFN molded strip using experimental and modeling methods
Quad Flat No-lead (QFN) package is manufactured in a molded array format that maximizes product throughput. However, the excessive warpage and stress induced by thermal mismatch among different materials may affect the assembly processes due to the large matrix of the molded strip. In this study, bo...
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| 主要な著者: | , , , , , |
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2017
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| オンライン･アクセス: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5290 |
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