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Optimization of nickel thickness on substrate for TBGA using SAC387 solder material

The purpose of this paper is to discuss the effect of Nickel (Ni) thickness on lead free solder joint material for tape ball grid array (TBGA) application. In this study, four different level of Nickel thickness were chose that is 3um, 4um, 5um and 6 um. Ball pull testing was used to assess the sold...

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Main Authors: Ahmad, I., Majlis, B.Y., Jalar, A., Leng, E.P.
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Published: 2017
Online Access:http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5287
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spelling my.uniten.dspace-52872017-11-15T02:57:18Z Optimization of nickel thickness on substrate for TBGA using SAC387 solder material Ahmad, I. Majlis, B.Y. Jalar, A. Leng, E.P. The purpose of this paper is to discuss the effect of Nickel (Ni) thickness on lead free solder joint material for tape ball grid array (TBGA) application. In this study, four different level of Nickel thickness were chose that is 3um, 4um, 5um and 6 um. Ball pull testing was used to assess the solder joint performance at time zero, after multiple reflow and high temperature storage (HTS). The machine that was used for the ball pull test is Dage 4000 series. A design of experiment (DOE) based approach is used to study and understand ball pull strength data based on effect of Ni thickness. Statistical results performed shows that 4um is the most preferred thickness for the Ni layer, thus giving a significant effect, supported by thinner Intermetallic layer thickness and area. © 2007 IEEE. 2017-11-15T02:57:18Z 2017-11-15T02:57:18Z 2007 http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5287
institution Universiti Tenaga Nasional
building UNITEN Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
url_provider http://dspace.uniten.edu.my/
description The purpose of this paper is to discuss the effect of Nickel (Ni) thickness on lead free solder joint material for tape ball grid array (TBGA) application. In this study, four different level of Nickel thickness were chose that is 3um, 4um, 5um and 6 um. Ball pull testing was used to assess the solder joint performance at time zero, after multiple reflow and high temperature storage (HTS). The machine that was used for the ball pull test is Dage 4000 series. A design of experiment (DOE) based approach is used to study and understand ball pull strength data based on effect of Ni thickness. Statistical results performed shows that 4um is the most preferred thickness for the Ni layer, thus giving a significant effect, supported by thinner Intermetallic layer thickness and area. © 2007 IEEE.
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author Ahmad, I.
Majlis, B.Y.
Jalar, A.
Leng, E.P.
spellingShingle Ahmad, I.
Majlis, B.Y.
Jalar, A.
Leng, E.P.
Optimization of nickel thickness on substrate for TBGA using SAC387 solder material
author_facet Ahmad, I.
Majlis, B.Y.
Jalar, A.
Leng, E.P.
author_sort Ahmad, I.
title Optimization of nickel thickness on substrate for TBGA using SAC387 solder material
title_short Optimization of nickel thickness on substrate for TBGA using SAC387 solder material
title_full Optimization of nickel thickness on substrate for TBGA using SAC387 solder material
title_fullStr Optimization of nickel thickness on substrate for TBGA using SAC387 solder material
title_full_unstemmed Optimization of nickel thickness on substrate for TBGA using SAC387 solder material
title_sort optimization of nickel thickness on substrate for tbga using sac387 solder material
publishDate 2017
url http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5287
_version_ 1644493638984531968
score 13.214268

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