Effect of plasma cleaning process in the wettability of flip chip PBGA substrate of integrated circuit packages
This study investigated the plasma cleaning effect on two different commercially available packaging substrates used in the flip chip PBGA substrates for integrated circuit packaging. Investigation and related evaluation have been carried out to determine the wettability of the substrate surface. Co...
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| Main Authors: | , , |
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2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5254 |
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