Amin, N. (2017). Effect of plasma cleaning process in the wettability of flip chip PBGA substrate of integrated circuit packages.
استشهاد بنمط شيكاغوAmin, N. Effect of Plasma Cleaning Process in the Wettability of Flip Chip PBGA Substrate of Integrated Circuit Packages. 2017.
MLA استشهادAmin, N. Effect of Plasma Cleaning Process in the Wettability of Flip Chip PBGA Substrate of Integrated Circuit Packages. 2017.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.