Statistical optimization of process parameters for threshold voltage in 22 nm p-Type MOSFET using Taguchi method
This paper aims to study the effect of process parameter variation on a nano-scaled planar p-type MOSFET (metal-oxide-semiconductor field-effect transistor) device for 22 nm technology using Taguchi's L9 orthogonal array. The device was constructed with high-k/metal gate consisting of Titanium...
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my.uniten.dspace-51962017-11-15T02:56:30Z Statistical optimization of process parameters for threshold voltage in 22 nm p-Type MOSFET using Taguchi method Maheran, A.H.A. Menon, P.S. Shaari, S. Ahmad, I. Faizah, Z.A.N. This paper aims to study the effect of process parameter variation on a nano-scaled planar p-type MOSFET (metal-oxide-semiconductor field-effect transistor) device for 22 nm technology using Taguchi's L9 orthogonal array. The device was constructed with high-k/metal gate consisting of Titanium dioxide (TiO2) and Tungsten silicide (WSix) metal gate using an industrial-based numerical simulator. Using Taguchi's Signal-to-noise ratio (SNR) of nominal-the-best (NTB), the compensation implantation has been as identified as the dominant factor influencing the Vth value with 67.77% while the Halo implantation tilting angle has been identified as the adjustment factor. Upon optimization, the Vth value is-0.29538 V which is within the requirements of the International Technology Roadmap for Semiconductors (ITRS) 2012 which is-0.289 V ± 12.7 %. © 2015 IEEE. 2017-11-15T02:56:30Z 2017-11-15T02:56:30Z 2015 http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5196 |
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This paper aims to study the effect of process parameter variation on a nano-scaled planar p-type MOSFET (metal-oxide-semiconductor field-effect transistor) device for 22 nm technology using Taguchi's L9 orthogonal array. The device was constructed with high-k/metal gate consisting of Titanium dioxide (TiO2) and Tungsten silicide (WSix) metal gate using an industrial-based numerical simulator. Using Taguchi's Signal-to-noise ratio (SNR) of nominal-the-best (NTB), the compensation implantation has been as identified as the dominant factor influencing the Vth value with 67.77% while the Halo implantation tilting angle has been identified as the adjustment factor. Upon optimization, the Vth value is-0.29538 V which is within the requirements of the International Technology Roadmap for Semiconductors (ITRS) 2012 which is-0.289 V ± 12.7 %. © 2015 IEEE. |
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author |
Maheran, A.H.A. Menon, P.S. Shaari, S. Ahmad, I. Faizah, Z.A.N. |
spellingShingle |
Maheran, A.H.A. Menon, P.S. Shaari, S. Ahmad, I. Faizah, Z.A.N. Statistical optimization of process parameters for threshold voltage in 22 nm p-Type MOSFET using Taguchi method |
author_facet |
Maheran, A.H.A. Menon, P.S. Shaari, S. Ahmad, I. Faizah, Z.A.N. |
author_sort |
Maheran, A.H.A. |
title |
Statistical optimization of process parameters for threshold voltage in 22 nm p-Type MOSFET using Taguchi method |
title_short |
Statistical optimization of process parameters for threshold voltage in 22 nm p-Type MOSFET using Taguchi method |
title_full |
Statistical optimization of process parameters for threshold voltage in 22 nm p-Type MOSFET using Taguchi method |
title_fullStr |
Statistical optimization of process parameters for threshold voltage in 22 nm p-Type MOSFET using Taguchi method |
title_full_unstemmed |
Statistical optimization of process parameters for threshold voltage in 22 nm p-Type MOSFET using Taguchi method |
title_sort |
statistical optimization of process parameters for threshold voltage in 22 nm p-type mosfet using taguchi method |
publishDate |
2017 |
url |
http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5196 |
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1644493611297931264 |
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13.214268 |