Effect of different beam distances in laser soldering process: a numerical and experimental study

• Main Authors: Nazarudin M.Z.H., Abas M.A., Wan Ahmad Kamil W.M., Ahmad Nadzri F.F., A. Zahiri S., Mohd Sharif M.F., Che Ani F., Zawawi M.H.
• Other Authors: 58026562900
• Format: Article
• Published: Emerald Publishing 2025
• Subjects: Electronics packaging; Point defects; Power semiconductor diodes; Soldering; Stress relief; Void fraction; Wire; Finite volume method; Finite-volume method; Focus points; Laser soldering; Micro voids; Pin through-hole; Sac305; Solder joint quality; Soldering process; Through hole

Purpose: This paper aims to investigate the effect of different beam distance by understanding laser beam influence on solder joint quality. The utilisation numerical-based simulations and experimental validation will help to minimise the formation of micro void in PTH that can lead to cracks and de...