Effect of different beam distances in laser soldering process: a numerical and experimental study

• Main Authors: Nazarudin M.Z.H., Abas M.A., Wan Ahmad Kamil W.M., Ahmad Nadzri F.F., A. Zahiri S., Mohd Sharif M.F., Che Ani F., Zawawi M.H.
• Other Authors: 58026562900
• Format: Article
• Published: Emerald Publishing 2025
• Subjects: Electronics packaging; Point defects; Power semiconductor diodes; Soldering; Stress relief; Void fraction; Wire; Finite volume method; Finite-volume method; Focus points; Laser soldering; Micro voids; Pin through-hole; Sac305; Solder joint quality; Soldering process; Through hole

Purpose: This paper aims to investigate the effect of different beam distance by understanding laser beam influence on solder joint quality. The utilisation numerical-based simulations and experimental validation will help to minimise the formation of micro void in PTH that can lead to cracks and defects on passive devices. Design/methodology/approach: The research uses a combination approach of numerical-based simulation using Finite Volume Method (FVM) and experimental validation to explore the impact of different laser beam distances on solder joint quality in PTH assemblies. The study visualises solder flow and identifies the optimal beam distance for placing a soldering workpiece and a suitable tolerance distance for inserting the solder wire. Findings: The simulation results show the formation of micro void that occurs in PTH region with low volume fraction and unbalance heat concentration profile observed. The experimental results indicate that the focus point of the laser beam at a 99.0 mm distance yields the smallest beam size. Simulation visualisation demonstrates that the laser beam?s converging area at +4.6 mm from the focus point which provides optimal tolerance distances for placing the solder wire. The high-power laser diode exhibits maximum tolerance distance at 103.6 mm from the focus point where suitable beam distance for positioning of the soldering workpiece with 50% laser power. The simulation results align with the IPC-A-610 standard, ensuring optimal filling height, fillet shape with a 90� contact angle and defect-free. Practical implications: This research provides implications for the industry by demonstrating the capability of the simulation approach to produce high-quality solder joints. The parameters, such as beam distance and power levels, offer practical guidelines for improving laser soldering processes in the manufacturing industry. Originality/value: This study contributes to the field by combining high-power laser diode technology with numerical-based simulations to optimise the beam distance parameters for minimising micro void formation in the PTH region. ? 2024, Emerald Publishing Limited.