Improvement of cu-al bond integrity on low k pad structures
TS270.O54 2011
Saved in:
| Main Author: | |
|---|---|
| Format: | text::Final Year Project |
| Language: | English |
| Published: |
2024
|
| Subjects: | |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| id |
my.uniten.dspace-32979 |
|---|---|
| record_format |
dspace |
| spelling |
my.uniten.dspace-329792024-08-04T02:05:37Z Improvement of cu-al bond integrity on low k pad structures Ooi, Xin Yi Copper wire TS270.O54 2011 Since 1950's, Gold wire-bonding has been introduced into the field of interconnection of ICs and it becomes the main interconnection process in the semiconductor packaging industry. Gold wires are commonly used for wire-bonding and it fits well the industrial requirements. However, the price of Gold wires increasing significantly, Copper wires is a potential replacement for Gold due to their superior electrical and mechanical properties. In general, Cu-Al intermetallics have better electrical and thermal qualities than Cu-Al intermetallics. In order to incorporate Cu in the wire- bonding process, substantial data regarding aging and intermetallic formation of Cu- Al bonds is required and the results are compared with Au samples. In this study, the bond integrity and thermal aging of Cu-Al and Au-Al wire-bonds were investigated. The Copper and Gold wire-bonds samples were heat-treated at 175°C for 168, 504 and 1008 hours while at temperature of 225°C for 4.5, 13.5, 26, 52 and 97 hours respectively. The intermetallics of the wire-bonds, and in particular the Al-Cu interface, were studied. Discontinuous and non-uniform of Cu-Al intermetallics regions were found in the thermal aging samples. The thickness of Cu-Al intermetallics is growing linearly with the temperature as the diffusion rate increases in higher temperature. The Cu-Al bond is weak compare to Au-Al in accordance with aging through wire pull test. 2024-07-30T07:30:56Z 2024-07-30T07:30:56Z 2011 Resource Types::text::Final Year Project https://irepository.uniten.edu.my/handle/123456789/32979 en application/pdf |
| institution |
Universiti Tenaga Nasional |
| building |
UNITEN Library |
| collection |
Institutional Repository |
| continent |
Asia |
| country |
Malaysia |
| content_provider |
Universiti Tenaga Nasional |
| content_source |
UNITEN Institutional Repository |
| url_provider |
http://dspace.uniten.edu.my/ |
| language |
English |
| topic |
Copper wire |
| spellingShingle |
Copper wire Ooi, Xin Yi Improvement of cu-al bond integrity on low k pad structures |
| description |
TS270.O54 2011 |
| format |
Resource Types::text::Final Year Project |
| author |
Ooi, Xin Yi |
| author_facet |
Ooi, Xin Yi |
| author_sort |
Ooi, Xin Yi |
| title |
Improvement of cu-al bond integrity on low k pad structures |
| title_short |
Improvement of cu-al bond integrity on low k pad structures |
| title_full |
Improvement of cu-al bond integrity on low k pad structures |
| title_fullStr |
Improvement of cu-al bond integrity on low k pad structures |
| title_full_unstemmed |
Improvement of cu-al bond integrity on low k pad structures |
| title_sort |
improvement of cu-al bond integrity on low k pad structures |
| publishDate |
2024 |
| _version_ |
1806517978284425216 |
| score |
13.222552 |