Reduction of warpage occurrence on stack-die QFN using FEA and statistical method

Warpage is greatly affected by package geometries, such as dimension of matrix array, pad, die and passive components as well as molding compound properties. It is also related to thermal mismatch i.e. coefficient of thermal expansion (CTE) and reliability of passive components in the package. So in...

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Bibliographic Details
Main Authors: Abdullah I., Ahmad I., Talib M.Z.M., Kamarudin M.N.B.C.
Other Authors: 24721493100
Format: Conference paper
Published: 2023
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