Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging

• Main Authors: Shualdi W., Ahmad I., Omar G., Isnin A.
• Other Authors: 36194999100
• Format: Conference paper
• Published: 2023
• Subjects: Grain boundary diffusion; Intermetallic compound (IMC); Thermal aging; Voids; Antimony compounds; Diffusion; Electronics packaging; Grain boundaries; Grain size and shape; Lead; Lead compounds; Semiconducting intermetallics; Silver; Soldering alloys; Aging time; Base metals; Electronic Packaging; Grain-boundary diffusion; IMC layer; Intermetallic compound growths; Intermetallic compounds; Intermetallic growth; Lead free solders; Power package; Power packaging; Solder joint reliability; Tin

Intermetallic compound (IMC) growth behavior plays an important role in solder joint reliability of electronic packaging assemblies. The growth of interfacial IMC compounds and the interfacial voids/crack formation between Sn-25Ag-10Sb lead-free solders and Nickel plated Cu in power package subject...