Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging

• Main Authors: Shualdi W., Bais B., Ahmad I., Omar G., Isnin A.
• Other Authors: 36194999100
• Format: Conference paper
• Published: 2023
• Subjects: Intermetallic compound; nanoindentation; SnAgSb lead free; Young modulus; Copper alloys; Hardness; Interfaces (materials); Intermetallics; Nanoindentation; Silver; Silver alloys; Soldering alloys; Substrates; Thermal aging; Aging time; Cu substrate; Die-attach materials; Electronic product; IMC layer; Lead-free solder alloy; Nanoindentation tests; Solder joints; Tin

Intermetallic compound (IMC) plays great roles in connecting components to PCB boards, as well as die attach materials connecting chips to substrates. Cracks in IMC may leads to failure in an electronic product function. Therefore it is important to investigate the mechanical properties of the IMC t...