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Study on reliability test of die attach material

Silver plated copper is a new developed die attachment material to replace pure silver. As year past, price of silver getting higher and become a problem for those semiconductors packaging company. Therefore, silver plated copper was developed as new die attachment material to solve the costing prob...

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Bibliographic Details
Main Authors: Yik L.C., Kar Y.B., Shafika N.
Other Authors: 55787504300
Format: Conference paper
Published: 2023
Subjects:
copper
filler
reliability
silver
test method
Fillers
Industrial electronics
Manufacture
Reliability
Silver
Silver plating
Testing
Die attachment
Die-attach materials
Packaging companies
Reliability test
Test method
Copper
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Summary:Silver plated copper is a new developed die attachment material to replace pure silver. As year past, price of silver getting higher and become a problem for those semiconductors packaging company. Therefore, silver plated copper was developed as new die attachment material to solve the costing problem. But the characteristic and reliability of silver plated copper filler has be a doubt to replace the pure silver in the market. This paper will review few test method to test on the reliability of silver plated copper filler and proved that it is as good as silver to be the filler. � 2012 IEEE.

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