Solder ball robustness study on polymer core solder balls for BGA packages

• Main Authors: Kar Y.B., Hui T.C., Agileswari, Lo C.
• Other Authors: 26649255900
• Format: Conference paper
• Published: 2023
• Subjects: Coatings; Drops; Hazardous materials; Industrial electronics; Lead; Manufacture; Nickel; Polymers; Reliability; Semiconductor device manufacture; Soldered joints; Soldering alloys; Testing; Tin; Drop test reliability; High temperature storage; Polymer core solder balls; Reliability performance; Restriction of hazardous Substances; Robustness studies; Semiconductor industry; Temperature cycles; Soldering

Restriction of Hazardous Substance (RoHS) Regulation came into effect in 2006 due to the hazardous effects of lead to human's health and toxicity for environment. As such, the leaded solder ball was replaced by lead-free solder ball which is now widely used in semiconductor industries. However,...