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Characterization of micropearl polymer core solder ball for BGA semiconductor packaging application

THS TK7870.T36 2012

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Bibliographic Details
Main Author: Tan Cai Hui
Format: text::Thesis
Language:English
Published: 2023
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id my.uniten.dspace-19533
record_format dspace
spelling my.uniten.dspace-195332023-05-04T17:31:03Z Characterization of micropearl polymer core solder ball for BGA semiconductor packaging application Tan Cai Hui THS TK7870.T36 2012 2023-05-03T13:36:40Z 2023-05-03T13:36:40Z 2012-06 Resource Types::text::Thesis https://irepository.uniten.edu.my/handle/123456789/19533 en application/pdf
institution Universiti Tenaga Nasional
building UNITEN Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
url_provider http://dspace.uniten.edu.my/
language English
description THS TK7870.T36 2012
format Resource Types::text::Thesis
author Tan Cai Hui
spellingShingle Tan Cai Hui
Characterization of micropearl polymer core solder ball for BGA semiconductor packaging application
author_facet Tan Cai Hui
author_sort Tan Cai Hui
title Characterization of micropearl polymer core solder ball for BGA semiconductor packaging application
title_short Characterization of micropearl polymer core solder ball for BGA semiconductor packaging application
title_full Characterization of micropearl polymer core solder ball for BGA semiconductor packaging application
title_fullStr Characterization of micropearl polymer core solder ball for BGA semiconductor packaging application
title_full_unstemmed Characterization of micropearl polymer core solder ball for BGA semiconductor packaging application
title_sort characterization of micropearl polymer core solder ball for bga semiconductor packaging application
publishDate 2023
_version_ 1806425747422707712
score 13.214268

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