Detection of Bond Pad Discolorations at Outgoing Wafer Inspections

• Main Authors: Ngie, David Chua Sing, Shahrol, Mohamaddan, Shirley, Jonathan Tanjong, Abdullah, Yassin, Lim, Soh Fong
• Format: Article
• Language: English
• Published: Institute of Electrical and Electronics Engineers Inc. 2018
• Subjects: TA Engineering (General). Civil engineering (General)
• Online Access: http://ir.unimas.my/id/eprint/19916/1/Detection%20of%20Bond%20.pdf; http://ir.unimas.my/id/eprint/19916/; https://ieeexplore.ieee.org/document/8103795

Deployment of an automatic visual inspection system in semiconductor industry has become increasingly popular than ever not only due to its relatively high value as a yield analysis tool of outgoing products but more importantly for the prevention of defect escapee. A lot of studies are done on the...