Comments: Wafer bumping: A comparative technologies study

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Bibliographic Details
Main Author:	Mohd Khairuddin, Md Arshad
Format:	Article
Language:	English
Published:	Universiti Malaysia Perlis (UniMAP) 2010
Subjects:	Environ > Penerbitan Universiti UniMAP > Publications UniMAP > Pusat Pengajian Kejuruteraan Alam Sekitar UniMAP > Research and development Under bump metallurgy (UBM) Wafer bumping
Online Access:	http://dspace.unimap.edu.my/xmlui/handle/123456789/9705
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