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Wafer bumping: A comparative technologies study

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Bibliographic Details
Main Author: Mohd Khairuddin, Md Arshad
Format: Article
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2010
Subjects:
Environ > Penerbitan Universiti
UniMAP > Publications
UniMAP > Pusat Pengajian Kejuruteraan Alam Sekitar
UniMAP > Research and development
Under bump metallurgy (UBM)
Wafer bumping
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/9705
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id my.unimap-9705
record_format dspace
spelling my.unimap-97052010-10-06T02:20:10Z Wafer bumping: A comparative technologies study Mohd Khairuddin, Md Arshad Environ -- Penerbitan Universiti UniMAP -- Publications UniMAP -- Pusat Pengajian Kejuruteraan Alam Sekitar UniMAP -- Research and development Under bump metallurgy (UBM) Wafer bumping 2010-10-06T02:20:10Z 2010-10-06T02:20:10Z 2006-06 Article p.4-5 1823-9633 http://hdl.handle.net/123456789/9705 en Explore June 2006 Universiti Malaysia Perlis (UniMAP) Pejabat Timbalan Naib Canselor (Penyelidikan dan Inovasi)
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Environ -- Penerbitan Universiti
UniMAP -- Publications
UniMAP -- Pusat Pengajian Kejuruteraan Alam Sekitar
UniMAP -- Research and development
Under bump metallurgy (UBM)
Wafer bumping
spellingShingle Environ -- Penerbitan Universiti
UniMAP -- Publications
UniMAP -- Pusat Pengajian Kejuruteraan Alam Sekitar
UniMAP -- Research and development
Under bump metallurgy (UBM)
Wafer bumping
Mohd Khairuddin, Md Arshad
Wafer bumping: A comparative technologies study
format Article
author Mohd Khairuddin, Md Arshad
author_facet Mohd Khairuddin, Md Arshad
author_sort Mohd Khairuddin, Md Arshad
title Wafer bumping: A comparative technologies study
title_short Wafer bumping: A comparative technologies study
title_full Wafer bumping: A comparative technologies study
title_fullStr Wafer bumping: A comparative technologies study
title_full_unstemmed Wafer bumping: A comparative technologies study
title_sort wafer bumping: a comparative technologies study
publisher Universiti Malaysia Perlis (UniMAP)
publishDate 2010
url http://dspace.unimap.edu.my/xmlui/handle/123456789/9705
_version_ 1643789624812765184
score 13.214268

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