Growth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state aging

• Main Authors: Ramani, Mayappan, Rosyaini, A. Zaman, Zalina, Z. Abidin, Asmawati@FatinNajihah, Alias, Mohd N., Derman
• 其他作者: [e-mail]
• 格式: Working Paper
• 語言: English
• 出版: Universiti Malaysia Perlis 2010
• 主題: Cu5Zn8 Intermetallic; Lead-free Solder; Sn-Zn Solder; Energy dispersive x-ray (EDX); International Conference on X-Rays & Related Techniques in Research & Industry (ICXRI)
• 在線閱讀: http://dspace.unimap.edu.my/xmlui/handle/123456789/9060

International Conference on X-Rays and Related Techniques in Research and Industry (ICXRI 2010) jointly organized by Universiti Malaysia Perlis (UniMAP) and X-Ray Application Malaysia Society (XAPP), 9th - 10th June 2010 at Aseania Resort Langkawi, Malaysia.