Growth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state aging
International Conference on X-Rays and Related Techniques in Research and Industry (ICXRI 2010) jointly organized by Universiti Malaysia Perlis (UniMAP) and X-Ray Application Malaysia Society (XAPP), 9th - 10th June 2010 at Aseania Resort Langkawi, Malaysia.
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Universiti Malaysia Perlis
2010
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my.unimap-90602010-08-24T09:10:33Z Growth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state aging Ramani, Mayappan Rosyaini, A. Zaman Zalina, Z. Abidin Asmawati@FatinNajihah, Alias Mohd N., Derman ramani@perlis.uitm.edu.my Cu5Zn8 Intermetallic Lead-free Solder Sn-Zn Solder Energy dispersive x-ray (EDX) International Conference on X-Rays & Related Techniques in Research & Industry (ICXRI) International Conference on X-Rays and Related Techniques in Research and Industry (ICXRI 2010) jointly organized by Universiti Malaysia Perlis (UniMAP) and X-Ray Application Malaysia Society (XAPP), 9th - 10th June 2010 at Aseania Resort Langkawi, Malaysia. The phase and intermetallic thickness of Cu-Zn5 and Cu5Zn8 has been investigated under liquid state aging using reflow method. Both the intermetallic was formed by reacting Sn-9Zn lead free solder with copper substrate. Scanning electron microscope (SEM) was used to see the morphology of the phases and energy dispersive x-ray (EDX) was used to estimate the elemental compositions of the phases. The morphology of the Cu5Zn8 phase was rather flat but when the soldering temperature and tine increases, the morphology becomes scallop. Intermetallic thickness measurements show that the thickness of the Cu-Zn5 decreases with increasing soldering time and temperature. Whereas, the thickness of the Cu5Zn8 intermetallic increases with soldering time and temperature. 2010-08-24T09:10:33Z 2010-08-24T09:10:33Z 2010-06-09 Working Paper p.123-127 978-967-5760-02-0 http://hdl.handle.net/123456789/9060 en Proceedings of the International Conference on X-Rays & Related Techniques in Research & Industry (ICXRI) 2010 Universiti Malaysia Perlis School of Materials Engineering & School of Environmental Engineering |
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Universiti Malaysia Perlis |
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Malaysia |
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Universiti Malaysia Perlis |
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| language |
English |
| topic |
Cu5Zn8 Intermetallic Lead-free Solder Sn-Zn Solder Energy dispersive x-ray (EDX) International Conference on X-Rays & Related Techniques in Research & Industry (ICXRI) |
| spellingShingle |
Cu5Zn8 Intermetallic Lead-free Solder Sn-Zn Solder Energy dispersive x-ray (EDX) International Conference on X-Rays & Related Techniques in Research & Industry (ICXRI) Ramani, Mayappan Rosyaini, A. Zaman Zalina, Z. Abidin Asmawati@FatinNajihah, Alias Mohd N., Derman Growth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state aging |
| description |
International Conference on X-Rays and Related Techniques in Research and Industry (ICXRI 2010) jointly organized by Universiti Malaysia Perlis (UniMAP) and X-Ray Application Malaysia Society (XAPP), 9th - 10th June 2010 at Aseania Resort Langkawi, Malaysia. |
| author2 |
ramani@perlis.uitm.edu.my |
| author_facet |
ramani@perlis.uitm.edu.my Ramani, Mayappan Rosyaini, A. Zaman Zalina, Z. Abidin Asmawati@FatinNajihah, Alias Mohd N., Derman |
| format |
Working Paper |
| author |
Ramani, Mayappan Rosyaini, A. Zaman Zalina, Z. Abidin Asmawati@FatinNajihah, Alias Mohd N., Derman |
| author_sort |
Ramani, Mayappan |
| title |
Growth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state aging |
| title_short |
Growth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state aging |
| title_full |
Growth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state aging |
| title_fullStr |
Growth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state aging |
| title_full_unstemmed |
Growth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state aging |
| title_sort |
growth of cu-zn5 and cu5zn8 intermetallic compounds in the sn-9zn/cu joint during liquid state aging |
| publisher |
Universiti Malaysia Perlis |
| publishDate |
2010 |
| url |
http://dspace.unimap.edu.my/xmlui/handle/123456789/9060 |
| _version_ |
1643789380305813504 |
| score |
13.214268 |