Comments: The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM)

Organized by Universiti Putra Malaysia (UPM), 6th - 8th December 2005 at Putra World Trade Centre (PWTC), Kuala Lumpur.

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Bibliographic Details
Main Authors:	Mohd Khairuddin, Md Arshad, Ibrahim, Ahmad, Azman, Jalar, Uda, Hashim
Format:	Working Paper
Language:	English
Published:	Universiti Putra Malaysia (UPM) 2009
Subjects:	Under bump metallurgy (UBM) Wafer bumping Electroless nickel immersion gold (ENIG) Surface roughness Electroless deposition Nickel-plating
Online Access:	http://dspace.unimap.edu.my/xmlui/handle/123456789/6339
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