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The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM)

Organized by Universiti Putra Malaysia (UPM), 6th - 8th December 2005 at Putra World Trade Centre (PWTC), Kuala Lumpur.

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Bibliographic Details
Main Authors: Mohd Khairuddin, Md Arshad, Ibrahim, Ahmad, Azman, Jalar, Uda, Hashim
Format: Working Paper
Language:English
Published: Universiti Putra Malaysia (UPM) 2009
Subjects:
Under bump metallurgy (UBM)
Wafer bumping
Electroless nickel immersion gold (ENIG)
Surface roughness
Electroless deposition
Nickel-plating
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/6339
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spelling my.unimap-63392009-07-07T04:38:21Z The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM) Mohd Khairuddin, Md Arshad Ibrahim, Ahmad Azman, Jalar Uda, Hashim Under bump metallurgy (UBM) Wafer bumping Electroless nickel immersion gold (ENIG) Surface roughness Electroless deposition Nickel-plating Organized by Universiti Putra Malaysia (UPM), 6th - 8th December 2005 at Putra World Trade Centre (PWTC), Kuala Lumpur. The low cost deposition of under bump metallurgy (UBM) method presented in this paper is based on electroless nickel immersion gold (ENIG) bumping process. The study is focuses on the effect of temperature, pH and exposure time to the deposition of nickel thickness. Metallurgical cross-section and image capturing system were used as analytical tools. Result suggests that with the increase of temperature, pH and exposure time, the nickel thickness also increased. 2009-07-07T04:38:21Z 2009-07-07T04:38:21Z 2005-12-06 Working Paper http://hdl.handle.net/123456789/6339 en International Advanced Technology Congress Universiti Putra Malaysia (UPM)
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Under bump metallurgy (UBM)
Wafer bumping
Electroless nickel immersion gold (ENIG)
Surface roughness
Electroless deposition
Nickel-plating
spellingShingle Under bump metallurgy (UBM)
Wafer bumping
Electroless nickel immersion gold (ENIG)
Surface roughness
Electroless deposition
Nickel-plating
Mohd Khairuddin, Md Arshad
Ibrahim, Ahmad
Azman, Jalar
Uda, Hashim
The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM)
description Organized by Universiti Putra Malaysia (UPM), 6th - 8th December 2005 at Putra World Trade Centre (PWTC), Kuala Lumpur.
format Working Paper
author Mohd Khairuddin, Md Arshad
Ibrahim, Ahmad
Azman, Jalar
Uda, Hashim
author_facet Mohd Khairuddin, Md Arshad
Ibrahim, Ahmad
Azman, Jalar
Uda, Hashim
author_sort Mohd Khairuddin, Md Arshad
title The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM)
title_short The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM)
title_full The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM)
title_fullStr The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM)
title_full_unstemmed The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM)
title_sort effect of temperature, ph and exposure time to electroless nickel deposition for under bump metallurgy (ubm)
publisher Universiti Putra Malaysia (UPM)
publishDate 2009
url http://dspace.unimap.edu.my/xmlui/handle/123456789/6339
_version_ 1643788430237237248
score 13.222552

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