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LED heat dissipation analysis using composite based cylindrical slug

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Bibliographic Details
Main Authors: Zaliman, Sauli, Dr., Vairavan, Rajendaran, Retnasamy, Vithyacharan
Other Authors: zaliman@unimap.edu.my
Format: Article
Language:English
Published: Trans Tech Publications Inc. 2015
Subjects:
ANSYS
Cu/Dia cylindrical heat slug
Junction temperature
LED
Von mises stress
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/39128
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spelling my.unimap-391282015-03-06T09:11:17Z LED heat dissipation analysis using composite based cylindrical slug Zaliman, Sauli, Dr. Vairavan, Rajendaran Retnasamy, Vithyacharan zaliman@unimap.edu.my ANSYS Cu/Dia cylindrical heat slug Junction temperature LED Von mises stress Link to publisher's homepage at http://www.ttp.net/ The optical efficacy and reliability of light emitting diode is extensively influenced by the operating junction temperature of the LED. Therefore, the evaluation of junction temperature is significant. This paper reports a simulation analysis on the heat dissipation of single chip LED package with based material, copper diamond (Cu/Dia) cylindrical heat slug.Ansys version 11 was utilized as the simulation platform. The junction temperature and stress of the LED chip under natural convection condition were evaluated with varied input power of 0.1 W, 0.5 W and 1 W. Results indicated the maximum junction temperature of LED chip was attained at input power of 1 W. 2015-03-06T09:11:17Z 2015-03-06T09:11:17Z 2014-02 Article Advanced Materials Research, vol.893, 2014, pages 803-806 1662-8985 http://dspace.unimap.edu.my:80/xmlui/handle/123456789/39128 http://www.scientific.net/AMR.893.803 en Trans Tech Publications Inc.
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic ANSYS
Cu/Dia cylindrical heat slug
Junction temperature
LED
Von mises stress
spellingShingle ANSYS
Cu/Dia cylindrical heat slug
Junction temperature
LED
Von mises stress
Zaliman, Sauli, Dr.
Vairavan, Rajendaran
Retnasamy, Vithyacharan
LED heat dissipation analysis using composite based cylindrical slug
description Link to publisher's homepage at http://www.ttp.net/
author2 zaliman@unimap.edu.my
author_facet zaliman@unimap.edu.my
Zaliman, Sauli, Dr.
Vairavan, Rajendaran
Retnasamy, Vithyacharan
format Article
author Zaliman, Sauli, Dr.
Vairavan, Rajendaran
Retnasamy, Vithyacharan
author_sort Zaliman, Sauli, Dr.
title LED heat dissipation analysis using composite based cylindrical slug
title_short LED heat dissipation analysis using composite based cylindrical slug
title_full LED heat dissipation analysis using composite based cylindrical slug
title_fullStr LED heat dissipation analysis using composite based cylindrical slug
title_full_unstemmed LED heat dissipation analysis using composite based cylindrical slug
title_sort led heat dissipation analysis using composite based cylindrical slug
publisher Trans Tech Publications Inc.
publishDate 2015
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/39128
_version_ 1643798987700961280
score 13.214268

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