封面图片

Epoxy -recycled copper (e-recop) as thermoforming mold materials

Received a Silver medal in 25th International Invention, Innovation & Technology Exhibition (ITEX'14), 8th-10th May at Kuala Lumpur Convention Centre.

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书目详细资料
主要作者:	Teh Pei Leng, Dr.
格式:	Other
语言:	English
出版:	Universiti Malaysia Perlis (UniMAP) 2014
主题:	International Invention, Innovation & Technology Exhibition (ITEX'14) Mold materials Termoforming mold Recycle copper Low cost mold
在线阅读:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/36079
标签:	添加标签没有标签, 成为第一个标记此记录!

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