Teh Pei Leng, D. (2014). Epoxy -recycled copper (e-recop) as thermoforming mold materials. Universiti Malaysia Perlis (UniMAP).
Chicago Style CitationTeh Pei Leng, Dr. Epoxy -recycled Copper (e-recop) As Thermoforming Mold Materials. Universiti Malaysia Perlis (UniMAP), 2014.
MLA CitationTeh Pei Leng, Dr. Epoxy -recycled Copper (e-recop) As Thermoforming Mold Materials. Universiti Malaysia Perlis (UniMAP), 2014.
Warning: These citations may not always be 100% accurate.