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LED heat dissipation study using different Cu slug size

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Main Authors: Vairavan, Rajendaran, Retnasamy, Vithyacharan, Zaliman, Sauli, Dr., Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
Other Authors: rajendaran@gmail.com
Format: Article
Language:English
Published: AENSI Publisher All rights reserved 2014
Subjects:
Ansys
Copper rectangular heat slug
Heat slug size variation
Junction temperature
Single chip LED
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/35618
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spelling my.unimap-356182014-06-17T09:24:54Z LED heat dissipation study using different Cu slug size Vairavan, Rajendaran Retnasamy, Vithyacharan Zaliman, Sauli, Dr. Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. rajendaran@gmail.com vc.sundres@gmail.com zaliman@unimap.edu.my vc@unimap.edu.my Ansys Copper rectangular heat slug Heat slug size variation Junction temperature Single chip LED Link to publisher's homepage at http://www.aensiweb.com/ High power light emitting diodes (LEDs) have significant contribution in illumination industry due exceptional advantages in terms of low power consumption, superior reliability, prolonged life time and high efficiency. Rapid growth of the LEDs industry has generated a fresh set of thermal challenges which requires immediate attention. This paper presents a simulation work on a single chip high power LED package. This work focuses on the evaluation of the junction temperature and LED chip stress with varied copper rectangular heat slug size under natural convection condition at ambient temperature of 25°C. Ansys version 11 was used for the simulation. The single chip was powered with input power of 0.1 W and 1W respectively. Results exhibited that the heat slug size has significant effect on the junction temperature of the LED. 2014-06-17T09:24:54Z 2014-06-17T09:24:54Z 2013-10 Article Advances in Environmental Biology, vol. 7(SPEC. ISSUE 12), 2013, pages 3672-3676 1995-0756 http://www.aensiweb.com/old/aeb_October-special_2013.html http://dspace.unimap.edu.my:80/dspace/handle/123456789/35618 en AENSI Publisher All rights reserved
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Ansys
Copper rectangular heat slug
Heat slug size variation
Junction temperature
Single chip LED
spellingShingle Ansys
Copper rectangular heat slug
Heat slug size variation
Junction temperature
Single chip LED
Vairavan, Rajendaran
Retnasamy, Vithyacharan
Zaliman, Sauli, Dr.
Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
LED heat dissipation study using different Cu slug size
description Link to publisher's homepage at http://www.aensiweb.com/
author2 rajendaran@gmail.com
author_facet rajendaran@gmail.com
Vairavan, Rajendaran
Retnasamy, Vithyacharan
Zaliman, Sauli, Dr.
Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
format Article
author Vairavan, Rajendaran
Retnasamy, Vithyacharan
Zaliman, Sauli, Dr.
Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
author_sort Vairavan, Rajendaran
title LED heat dissipation study using different Cu slug size
title_short LED heat dissipation study using different Cu slug size
title_full LED heat dissipation study using different Cu slug size
title_fullStr LED heat dissipation study using different Cu slug size
title_full_unstemmed LED heat dissipation study using different Cu slug size
title_sort led heat dissipation study using different cu slug size
publisher AENSI Publisher All rights reserved
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/35618
_version_ 1643797865798041600
score 13.222552

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