Stress analysis of adhesive bonding of urea granulator fluidization bed

• Main Authors: Abu Nor, Bakyah, Mohd Afendi, Rojan, Dr., Mohd Shukry, Abdul Majid, Dr., Abdul Rahman, Abdullah, Shahriman, Abu Bakar, Dr.
• Other Authors: [e-mail]
• Format: Article
• Language: English
• Published: Trans Tech Publications 2014
• Subjects: Stress analysis; Adhesive bonding; Urea granulator fluidization bed; T-joint
• Online Access: http://dspace.unimap.edu.my:80/dspace/handle/123456789/35121

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