Stress analysis of adhesive bonding of urea granulator fluidization bed
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Trans Tech Publications
2014
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my.unimap-351212014-06-05T08:54:51Z Stress analysis of adhesive bonding of urea granulator fluidization bed Abu Nor, Bakyah Mohd Afendi, Rojan, Dr. Mohd Shukry, Abdul Majid, Dr. Abdul Rahman, Abdullah Shahriman, Abu Bakar, Dr. norbakyah.abu@gmail.com afendirojan@unimap.edu.my shukry@unimap.edu.my en.abdullah@gmail.com shahriman@unimap.edu.my Stress analysis Adhesive bonding Urea granulator fluidization bed T-joint Link to publisher's homepage at http://www.ttp.net/ Stress analysis of adhesive bonding of urea granulator fluidization bed was performed by using finite element method. The main objective of this project is to develop an alternative joining technique for urea granulator fluidizationbed by using adhesive bonding. The problem can solve by using commercial finite element package ANSYS version 13.0. T-joint and double T-joint are the main adhesive joints which will be focused in this project. The stresses on stainless steel plate can reduce by increasing the thickness of adhesive as demonstrated in numerical analysis results. Different thickness of adhesive will give different value of maximum von Mises stress. It shows that greater thickness resulted in higher maximum. This analysis proves that increasing the adhesive thickness will reduces the joint strength because stress was concentrated more on the adhesive interfaces. The adhesive bonding on T-joint is stronger than other design of joint because it need lower stress. It followed by first design of double T-joint and second design of double T-joint. 2014-06-05T08:54:51Z 2014-06-05T08:54:51Z 2014-06 Article Applied Mechanics and Materials, vol. 554, 2014, pages 160-164 1660-9336 http://www.scientific.net/AMM.554.160 http://dspace.unimap.edu.my:80/dspace/handle/123456789/35121 10.4028/www.scientific.net/AMM.554.160 en Trans Tech Publications |
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English |
| topic |
Stress analysis Adhesive bonding Urea granulator fluidization bed T-joint |
| spellingShingle |
Stress analysis Adhesive bonding Urea granulator fluidization bed T-joint Abu Nor, Bakyah Mohd Afendi, Rojan, Dr. Mohd Shukry, Abdul Majid, Dr. Abdul Rahman, Abdullah Shahriman, Abu Bakar, Dr. Stress analysis of adhesive bonding of urea granulator fluidization bed |
| description |
Link to publisher's homepage at http://www.ttp.net/ |
| author2 |
norbakyah.abu@gmail.com |
| author_facet |
norbakyah.abu@gmail.com Abu Nor, Bakyah Mohd Afendi, Rojan, Dr. Mohd Shukry, Abdul Majid, Dr. Abdul Rahman, Abdullah Shahriman, Abu Bakar, Dr. |
| format |
Article |
| author |
Abu Nor, Bakyah Mohd Afendi, Rojan, Dr. Mohd Shukry, Abdul Majid, Dr. Abdul Rahman, Abdullah Shahriman, Abu Bakar, Dr. |
| author_sort |
Abu Nor, Bakyah |
| title |
Stress analysis of adhesive bonding of urea granulator fluidization bed |
| title_short |
Stress analysis of adhesive bonding of urea granulator fluidization bed |
| title_full |
Stress analysis of adhesive bonding of urea granulator fluidization bed |
| title_fullStr |
Stress analysis of adhesive bonding of urea granulator fluidization bed |
| title_full_unstemmed |
Stress analysis of adhesive bonding of urea granulator fluidization bed |
| title_sort |
stress analysis of adhesive bonding of urea granulator fluidization bed |
| publisher |
Trans Tech Publications |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/35121 |
| _version_ |
1643797712758374400 |
| score |
13.222552 |