Stress analysis of adhesive bonding of urea granulator fluidization bed

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Main Authors: Abu Nor, Bakyah, Mohd Afendi, Rojan, Dr., Mohd Shukry, Abdul Majid, Dr., Abdul Rahman, Abdullah, Shahriman, Abu Bakar, Dr.
Other Authors: norbakyah.abu@gmail.com
Format: Article
Language:English
Published: Trans Tech Publications 2014
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Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/35121
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spelling my.unimap-351212014-06-05T08:54:51Z Stress analysis of adhesive bonding of urea granulator fluidization bed Abu Nor, Bakyah Mohd Afendi, Rojan, Dr. Mohd Shukry, Abdul Majid, Dr. Abdul Rahman, Abdullah Shahriman, Abu Bakar, Dr. norbakyah.abu@gmail.com afendirojan@unimap.edu.my shukry@unimap.edu.my en.abdullah@gmail.com shahriman@unimap.edu.my Stress analysis Adhesive bonding Urea granulator fluidization bed T-joint Link to publisher's homepage at http://www.ttp.net/ Stress analysis of adhesive bonding of urea granulator fluidization bed was performed by using finite element method. The main objective of this project is to develop an alternative joining technique for urea granulator fluidizationbed by using adhesive bonding. The problem can solve by using commercial finite element package ANSYS version 13.0. T-joint and double T-joint are the main adhesive joints which will be focused in this project. The stresses on stainless steel plate can reduce by increasing the thickness of adhesive as demonstrated in numerical analysis results. Different thickness of adhesive will give different value of maximum von Mises stress. It shows that greater thickness resulted in higher maximum. This analysis proves that increasing the adhesive thickness will reduces the joint strength because stress was concentrated more on the adhesive interfaces. The adhesive bonding on T-joint is stronger than other design of joint because it need lower stress. It followed by first design of double T-joint and second design of double T-joint. 2014-06-05T08:54:51Z 2014-06-05T08:54:51Z 2014-06 Article Applied Mechanics and Materials, vol. 554, 2014, pages 160-164 1660-9336 http://www.scientific.net/AMM.554.160 http://dspace.unimap.edu.my:80/dspace/handle/123456789/35121 10.4028/www.scientific.net/AMM.554.160 en Trans Tech Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Stress analysis
Adhesive bonding
Urea granulator fluidization bed
T-joint
spellingShingle Stress analysis
Adhesive bonding
Urea granulator fluidization bed
T-joint
Abu Nor, Bakyah
Mohd Afendi, Rojan, Dr.
Mohd Shukry, Abdul Majid, Dr.
Abdul Rahman, Abdullah
Shahriman, Abu Bakar, Dr.
Stress analysis of adhesive bonding of urea granulator fluidization bed
description Link to publisher's homepage at http://www.ttp.net/
author2 norbakyah.abu@gmail.com
author_facet norbakyah.abu@gmail.com
Abu Nor, Bakyah
Mohd Afendi, Rojan, Dr.
Mohd Shukry, Abdul Majid, Dr.
Abdul Rahman, Abdullah
Shahriman, Abu Bakar, Dr.
format Article
author Abu Nor, Bakyah
Mohd Afendi, Rojan, Dr.
Mohd Shukry, Abdul Majid, Dr.
Abdul Rahman, Abdullah
Shahriman, Abu Bakar, Dr.
author_sort Abu Nor, Bakyah
title Stress analysis of adhesive bonding of urea granulator fluidization bed
title_short Stress analysis of adhesive bonding of urea granulator fluidization bed
title_full Stress analysis of adhesive bonding of urea granulator fluidization bed
title_fullStr Stress analysis of adhesive bonding of urea granulator fluidization bed
title_full_unstemmed Stress analysis of adhesive bonding of urea granulator fluidization bed
title_sort stress analysis of adhesive bonding of urea granulator fluidization bed
publisher Trans Tech Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/35121
_version_ 1643797712758374400
score 13.214268